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Having the Analysis tools appropriate to the product evolution cycle is essential.  The TYNE founders, being experienced industry professionals, recognize your needs and have set about providing the most comprehensive EDA tool suite to meet the requirements of the most demanding of super users.


Our EDA and KM solutions target the relentless continuous improvement cycle within the industry.

  • The Hi Tech Industry goes through regular product, design integration and shrink upgrade cycles.
  • Previous generation products and technologies are constantly replaced.
  • Engineering resources are required to ramp Fabs to maximum volume with high yields whilst simultaneously developing the next generation.
  • Complexity increases as more products are introduced in increasingly faster timeframes.
  • The relentless product evolution can be simplified into 3 distinct phases - Development, Ramp, and Manufacturing.



Phase I   Product/Process development

  • 1st Hardware - a few lots from single tools at each operation only.
  • Early Design / Test / Process window issues > lower yields.
  • Process vs. product maturity > many signatures for analysis.
  • Product debug, design characterization and customer samples.
  • Generate Qualification lots - excursion vs. baseline issue risks.

  • Good data correlation capability, covering CP, Device, Defect & Inline data for analysis within the same data types & across multiple data types.
  • Single and Composite map analysis for data types; CP, Device, Defect and In-line.
  • Map overlay between certain data types: CP overlay with Device or Defect.
  • Statistical analysis for correlation studies and testing different sample groups.
  • Lot characterization reports / charts for local analysis & reporting to remote development resources.
  • Die / Panel level classification for the 1st Yield Loss and defect impact calculations.
  • Fab 'Run card' information.
  • Parametric and Defect Code reports.
  • Wafer / Glass level failure pareto charts (Bin, Test, vector, Defect Code, ...).
  • Wafer / Glass & Lot level Yield reports

Characterisation of 1st Hardware.



Phase 2   Volume Ramp and Yield Improvement Roadmap
 
  • Higher Fab volume.  Design, process, product and test maturing.
  • Second, third,... equipment releases at the same process steps.
  • Improving yields, but high variability on both old & new hardware.
  • Characterization is complete.  1st design/process fixes underway.
  • Many loss signatures and classification/prioritisation is required.
  • "Systematic Defects"- 1st core technology issues understood.
  • 1st Yield Improvement Roadmap (YIR) defined.

  • Equipment Correlation trends.
  • Timeline commonality analysis.
  • Equipment/Recipe/Operator commonality.
  • Advanced commonality tools.
  • Design and Analysis of Experiments.
  • Temporary process change analysis.
  • Process grade monitoring.
  • Wafer / Glass level classification.
  • Yield limiter Analysis.
  • Yield loss pareto generation.
  • Yield roadmap and yield model definitions.
  • "Collections", Knowledge Management.
  • Track process changes, contain events.
  • Yield prediction functionality.
  • Implement 1st personal Data Analysis preferences & job scheduling systems.
  • Establish cross functional Yield Improvement teams and Steering Groups.
  • Standardise routine activities into documented workflow systems.
  • Documentation of signatures and associated Engineering reports (KM).

Drive 1st opportunities through detect, fix, pilot verification and successful closure.



Phase 3 High Volume Manufacturing.
  • Main volume ramp complete.  Yield Roadmap 90% of tasks done.
  • Fewer issues, focus on sustaining and excursion control.
  • "Random Defects" - continuous drive for reduced defectivity.
  • Continuous Improvement emphasis is on finding remaining yield opportunities, process simplification and cost reduction.
  • Reduce variation and "Tighten the distribution".
  • Fewer resources supporting higher volume.

  • Phase I & 2 Engineering Data Analysis tools but with added automation.
  • 'Point & Click' Lot review and classification.
  • Change from Wafer / Glass based classification to Lot level classification.
  • Automated lot review (pattern recognition), excursion detection and 1st pass debug.
  • Batch systems for Lot and Time based Engineering Data Analysis.
  • Full implementation of Knowledge Management and Systematic workflows. (preferably with MES interfaces).
  • Parametric Sensitivity Analysis.
  • Defect Kill ratio analysis.
  • Higher Volume pilot analysis "Shotgun" correlation.
  • Background Commonality studies.
  • Principal Component analysis, Decision Trees and Data mining.
  • Process Window analysis & fine tuning.
  • Best Tool matching.
  • HILO yield analysis.

Continuous Improvement becomes part of the Company culture.




Coupling TYNE's Advanced Yield Enhancement and Data Analysis System (AYEDAS) with our KM solutions,   Engineering Daily Review System (EDRS) and Lot Review and Classification System (LRCS), will instil the systematic Continuous Improvement discipline as seen in all World Class fabrication facilities.  Once installed at your site, in an environment of real time support and cooperation, the Total Yield Management System will enable you to accelerate your yield ramp to previously unprecedented levels thus realizing your Full profit potential.

 


TYNE Systems Corporation.
TEL:+886-3-5726781 FAX:+886-3-5737833