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Having the Analysis tools appropriate to the product evolution cycle
is essential. The TYNE founders, being experienced industry professionals,
recognize your needs and have set about providing the most comprehensive EDA tool suite to meet the requirements of the most demanding
of super users.
Our EDA and KM solutions target the relentless
continuous improvement cycle within the industry.
- The Hi Tech Industry goes through regular product, design integration
and shrink upgrade cycles.
- Previous generation products and technologies are constantly replaced.
- Engineering resources are required to ramp Fabs to maximum
volume with high yields whilst simultaneously developing the
next generation.
- Complexity increases as more products are introduced in increasingly
faster timeframes.
- The relentless product evolution can be simplified into 3 distinct
phases - Development, Ramp, and Manufacturing.
 Phase
I Product/Process development
- 1st Hardware - a few lots from single tools at each
operation only.
- Early Design / Test / Process window issues > lower yields.
- Process vs. product maturity > many signatures for
analysis.
- Product debug, design characterization and customer
samples.
- Generate Qualification lots - excursion vs. baseline
issue risks.
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- Good data correlation capability, covering CP, Device,
Defect & Inline data for analysis within the same data types & across
multiple data types.
- Single and Composite map analysis for data types; CP,
Device, Defect and In-line.
- Map overlay between certain data types: CP overlay with
Device or Defect.
- Statistical analysis for correlation studies and testing
different sample groups.
- Lot characterization reports / charts for local analysis
& reporting to remote development resources.
- Die / Panel level classification for the 1st Yield Loss
and defect impact calculations.
- Fab 'Run card' information.
- Parametric and Defect Code reports.
- Wafer / Glass level failure pareto charts (Bin, Test,
vector, Defect Code, ...).
- Wafer / Glass & Lot level Yield reports
Characterisation of 1st Hardware.
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Phase
2 Volume Ramp and Yield Improvement Roadmap
- Higher Fab volume. Design, process, product and test maturing.
- Second, third,... equipment releases at the same process
steps.
- Improving yields,
but high variability on both old & new hardware.
- Characterization is complete. 1st design/process fixes
underway.
- Many loss signatures and classification/prioritisation
is required.
- "Systematic Defects"- 1st core technology issues
understood.
- 1st Yield Improvement Roadmap (YIR) defined.
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- Equipment Correlation trends.
- Timeline commonality analysis.
- Equipment/Recipe/Operator commonality.
- Advanced commonality tools.
- Design and Analysis of Experiments.
- Temporary process change analysis.
- Process grade monitoring.
- Wafer / Glass level classification.
- Yield limiter Analysis.
- Yield loss pareto generation.
- Yield roadmap and yield model definitions.
- "Collections", Knowledge Management.
- Track process changes, contain events.
- Yield prediction functionality.
- Implement 1st personal Data Analysis preferences & job
scheduling systems.
- Establish cross functional Yield Improvement teams and
Steering Groups.
- Standardise routine activities into documented workflow
systems.
- Documentation of signatures and associated Engineering
reports (KM).
Drive 1st opportunities through detect,
fix, pilot verification and successful closure.
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Phase
3 High Volume Manufacturing.
- Main volume ramp complete. Yield Roadmap 90% of
tasks done.
- Fewer issues, focus on sustaining and excursion control.
- "Random Defects" - continuous drive for reduced
defectivity.
- Continuous Improvement emphasis is on finding remaining
yield opportunities, process
simplification and cost reduction.
- Reduce variation and "Tighten the distribution".
- Fewer resources supporting higher volume.
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- Phase I & 2 Engineering Data Analysis tools but with
added automation.
- 'Point & Click' Lot review and classification.
- Change from Wafer / Glass based classification to Lot
level classification.
- Automated lot review (pattern recognition), excursion detection and 1st pass debug.
- Batch systems for Lot and Time based Engineering Data
Analysis.
- Full implementation of Knowledge Management and
Systematic workflows. (preferably with MES interfaces).
- Parametric Sensitivity Analysis.
- Defect Kill ratio analysis.
- Higher Volume pilot analysis "Shotgun" correlation.
- Background Commonality studies.
- Principal Component analysis, Decision Trees and Data mining.
- Process Window analysis & fine tuning.
- Best Tool matching.
- HILO yield analysis.
Continuous Improvement becomes part of
the Company culture.
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Coupling TYNE's Advanced Yield
Enhancement and Data Analysis System (AYEDAS) with our KM solutions,
Engineering Daily Review System (EDRS) and Lot
Review and Classification System (LRCS), will instil the systematic
Continuous Improvement discipline as seen in all
World Class fabrication facilities. Once installed at your site, in an environment
of real time support and cooperation, the Total Yield Management
System will enable you to accelerate
your yield ramp to previously unprecedented levels thus realizing
your Full profit potential.
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